86 15303936561
sales@hsd-tech.com
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Laser Engraving&Cutting
Fiber Laser Marker
CO2 Laser Marker
UV Laser Marker
Mopa Laser Marker
3D Laser Marker
Flying Laser Marker
CO2 Laser Cutter
Fiber Laser Cutter
Laser Welding&Cleaning
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Jewelry Laser Welder
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About Us
Laser Engraving&Cutting
Fiber Laser Marker
CO2 Laser Marker
UV Laser Marker
Mopa Laser Marker
3D Laser Marker
Flying Laser Marker
CO2 Laser Cutter
Fiber Laser Cutter
Laser Welding&Cleaning
Handheld Laser Welder
Pulsed Laser Cleaner
Jewelry Laser Welder
Service Support
New Center
Contact Us
搜索
86 15303936561
sales@hsd-tech.com
About Us
Laser Engraving&Cutting
Fiber Laser Marker
CO2 Laser Marker
UV Laser Marker
Mopa Laser Marker
3D Laser Marker
Flying Laser Marker
CO2 Laser Cutter
Fiber Laser Cutter
Laser Welding&Cleaning
Handheld Laser Welder
Pulsed Laser Cleaner
Jewelry Laser Welder
Service Support
New Center
Contact Us
…
About Us
Laser Engraving&Cutting
Fiber Laser Marker
CO2 Laser Marker
UV Laser Marker
Mopa Laser Marker
3D Laser Marker
Flying Laser Marker
CO2 Laser Cutter
Fiber Laser Cutter
Laser Welding&Cleaning
Handheld Laser Welder
Pulsed Laser Cleaner
Jewelry Laser Welder
Service Support
New Center
Contact Us
搜索
UV Laser Marker - hsd-tech.com
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Laser Welder&Cleaner
Laser Cutter
UV Laser Marker
Desktop UV Laser Marking Machine
UV laser marking machine uses 355nm wavelength laser, which is suitable for precision marking of materials including plastics (ABS, PC, PVC, HIPS, etc.), leather, metal, glass, LCD screen, thin ceramic, single crystal silicon wafer, IC grain, sapphire, etc. It is mainly used in 3C, automobile, electrical instrument, white household appliances, integrated circuit, medical equipment, hardware tools, food, medicine, etc., metal or non-metallic coating removal, marking of various materials, blind groove processing, emerging ultra-thin metal foil micro-hole production, etc.
Split UV Laser Marking Machine Air-Cooling
UV laser marking machine uses UV laser and third-order cavity frequency doubling technology. Compared with infrared laser, UV laser provides a small spot size and large focusing depth at 355nm. The short laser wavelength interrupts the molecular chain of the material, which can greatly reduce the mechanical deformation and temperature deformation of the material. It is a cold laser, mainly used for high-precision marking and engraving, especially suitable for food, pharmaceutical packaging material identification, micropores, high-speed division of glass, complex graphic wafer cutting of silicon materials, etc.
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