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86 15303936561
sales@hsd-tech.com
  • About Us
  • Laser Engraving&Cutting 
    • Fiber Laser Marker
    • CO2 Laser Marker
    • UV Laser Marker
    • Mopa Laser Marker
    • 3D Laser Marker
    • Flying Laser Marker
    • CO2 Laser Cutter
    • Fiber Laser Cutter
  • Laser Welding&Cleaning 
    • Handheld Laser Welder
    • Pulsed Laser Cleaner
    • Jewelry Laser Welder
    • Service Support
  • New Center
  • Contact Us
  • …  
    • About Us
    • Laser Engraving&Cutting 
      • Fiber Laser Marker
      • CO2 Laser Marker
      • UV Laser Marker
      • Mopa Laser Marker
      • 3D Laser Marker
      • Flying Laser Marker
      • CO2 Laser Cutter
      • Fiber Laser Cutter
    • Laser Welding&Cleaning 
      • Handheld Laser Welder
      • Pulsed Laser Cleaner
      • Jewelry Laser Welder
      • Service Support
    • New Center
    • Contact Us
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UV Laser Marker - hsd-tech.com

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Laser Welder&Cleaner
Laser Cutter
UV Laser Marker
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Desktop UV Laser Marking Machine

UV laser marking machine uses 355nm wavelength laser, which is suitable for precision marking of materials including plastics (ABS, PC, PVC, HIPS, etc.), leather, metal, glass, LCD screen, thin ceramic, single crystal silicon wafer, IC grain, sapphire, etc. It is mainly used in 3C, automobile, electrical instrument, white household appliances, integrated circuit, medical equipment, hardware tools, food, medicine, etc., metal or non-metallic coating removal, marking of various materials, blind groove processing, emerging ultra-thin metal foil micro-hole production, etc.

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Split UV Laser Marking Machine Air-Cooling

UV laser marking machine uses UV laser and third-order cavity frequency doubling technology. Compared with infrared laser, UV laser provides a small spot size and large focusing depth at 355nm. The short laser wavelength interrupts the molecular chain of the material, which can greatly reduce the mechanical deformation and temperature deformation of the material. It is a cold laser, mainly used for high-precision marking and engraving, especially suitable for food, pharmaceutical packaging material identification, micropores, high-speed division of glass, complex graphic wafer cutting of silicon materials, etc.

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